Recent comments in /f/gadgets

pi_designer t1_j1pspw3 wrote

Interesting fact. The silicon memory die has bond pads running down the centre and it is fitted face down. The package substrate has a slot running through the centre. The silicon is electrically connected to the bottom of the substrate (the side with solder balls) by wires stitched through the slot. This is then covered in a strip of mould compound visible in the image. Super fast signals, super cheap construction.

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KillerMan2219 t1_j1p5p3a wrote

Not that it's the case here, but remember that toyota issued a recall for people being dumbfucks with their floor mats, that was a "manufacturer defect" with the stuck gas pedals.

Just because a company issues a recall doesn't mean it was actually not user error.

Again, not that it is in this case, but something to keep in mind.

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